INDEX

Figure 1 Depth profiles of Cu concentration for the Ti-10 at%Cu alloys, as-polished and heat-treated at various temperatures in an Ar atmosphere.

Temperature dependence of yield stress of HfNbTaTiZr polycrystals compressed under different conditions (a). Spinodal decomposition of the alloy at 873 K (b).

Harnessing AM kinetics to obtain similar properties from a cheaper composition.

Typical micrographs of the Al film surfaces obtained on a Cu substrate by coulometric electrodeposition in AlCl₃-EMIC-toluene baths containing various additives.

Electron density of N atom in pyridine ring of additives examined in the electrodeposition of Al films vs. reflectance of the deposited Al film at 450 nm.

Temperature dependence of relative electrical conductivity. σ (5 K)_ω is electrical conductivity of ω phase of titanium at 5 K.

3D contour maps of the objective function I₂ predicted by the surrogate model are shown. The effects of hydrogen concentrations are shown for Al₇Cu₂Fe particles.

SCC crack propagation in (a) η and (b) T+Mn alloys: (i) SEM images showing cracks; (ii) EBSD showing IGC and TGC; (iii) KAM maps representing localized strain. (c) Multimodal characterization at the crack tip.

(a) Hardness evolution of the Al-Mg-Ga-In-Sn alloy through aging treatments at various temperatures ranging from 50°C to 300°C following solid-solution treatment (SST) at 500°C for 3 hr. The upper and lower horizontal dashed lines indicate the average Vickers hardness values of the as-cast and SSTed specimens, respectively. (b) TEM microstructure and (c) corresponding selected area diffraction (SAD) pattern of the Al matrix in the as-cast specimen, observed from [011] Al direction. In the SAD pattern, Al-corresponding spots were indexed, and precipitate-corresponding spots were indicated with circles.

The difference in wear debris characteristics among three different titanium alloys was discussed, which led to the respective effects of dimples on their wear behaviors.

Side views of the resulting two-layer aluminum foam, an X-ray CT images of a longitudinal section near the center of the sample, and the time t from the start of heating the precursor to the end of the heating process for heating and foaming two precursors with a gap between them.

SEM images of the surface of the anodized aluminum specimen prepared in 0.1 mol dm^-3 of NaOH solution containing glycerol at 40 V and 20°C for 30 min.

Schematic comparing nanohole arrays and nanopillar arrays in spontaneous movement of water droplets.

Logarithm of the normalized number of viable bacteria on the TiO₂ layers formed at the 2nd-step temperatures of 623, 673, and 923 K after visible-light irradiation or placement in the dark for 15 min. (** p < 0.01)

(a) Vickers hardness of unreinforced A6061 and in-situ AMC as a function of aging time and (b) nominal stress-strain curves of the peak-aged A6061 and in-situ AMC.

(a) Thermal conductivity and (b) coefficient of thermal expansion in the extrusion direction of 450°C-extruded Al/40vol% graphite samples as a function of Al-Si alloy content.

SEM observation of eutectic Si particles by deep etching in Al-10.44Si-0.25Mg-0.71Mn-0.25Fe die-cast alloy: The elongations to fracture were (a) 6.87 %, (b) 11.7 %, (c) 20.3 % and (d) 21.9 %, respectively. Microstructural changes can be found.

Unique “flower-like” lamellar microstructure, and schematics explaining the orientation relationship between β-Ti and B2-FeTi. Temperature dependence of the yield stress in compression tests is also displayed.

Stress-strain curves of Al-11mass%Si alloy casts without and with the grain refiner containing Al₃Ti particles and Na flux particles into Al-11 mass%Si alloy matrix.

Equilibrium phase diagrams for Al-Cu, Al-Ca, and Al-Mg binary systems, and SEM images showing the microstructure of the samples sintered using aluminum powder oxidized at 400°C, 450°C, and 550°C for 10.8 ks of Al-Cu alloy powders.

Neural network-based kinetic Monte Carlo simulations for GP-zone nucleation in Al–Cu alloys and the corresponding time-temperature-transformation diagram.

Relation between stress amplitude (σ _a) and number of cycles to failure (N) for the un-treated, zincate-treated, Ni-P low-P and high P plated and zinc plated specimens.

Load-displacement curves of the three alloy substrates untreated and plated in the three ways, subjected to the three-point bending test.

Vickers hardness and electrical conductivity of T6-tempered A7075 alloy sheets after rapid heating to various temperatures and re-aging at 170°C for 1.2 ks. The numbers within plots indicate holding times in second at a given rapid heating temperature.

Synchrotron X-ray computed tomography, together with various analytical methods for hydrogen detection in Al-Zn-Mg-based alloy with Ni–P plating.

The phase map of the TiAl powder with the β and α₂ phase (a) and schematic illustrations of the subsequent microstructural evolution (b).

Schematic illustration of multi-modal 3D image-based simulation to evaluate the relationship between local stress concentration, hydrogen accumulation and crack growth behavior in Al-Z-Mg alloy.

Nonflammability and oxidation resistance of Mg-Zn-Y alloys enhanced by beryllium segregation at grain boundaries of Y₂O₃ film.

Graphical Abstract
Schematic of the metallurgical phenomena occurring in Al-5.81Zn-1.65Mg alloy during thermomechanical processing.

Figure Plots of ultimate tensile strength at 473 K against strain rate for the Mg–5Al–1.5Ca–0.3Mn alloy.

Figure Misorientation within α-Mg grains for the AM50 alloy creep-ruptured at 448 K under a stress of 70 MPa; (a) fine grain and (b) coarse grain. Sub-boundaries are indicated with white arrowheads.

Results of hammering test and numerical simulation; (a) natural frequency, (b) damping ratio.

Comparison of ultimate tensile strength and total elongation of Ti-5Nb-xO alloys and Ti-6Al-4V (Gr. 5) alloy.

Coexistence of LPSO phase and decrease in extrusion speed induces the simultaneous increase in strength and elongation of Mg alloys via AMID mechanism.

STEM images and line profiles of magnesium and aluminum compositions near the bonding interface of explosively welded AZ80/A6005C cladding plates ((a) as welded, (b) annealed at 373 K, and (c) annealed at 473 K for 24 h) .

Architected materials informatics framework to optimize the geometry of cellular structures and its applications to the optimization of the geometry of cellular-structured heat sinks.

TiZrHfAgV_0.2 HEA was designed based on the concept of immiscibility of the constituent elements by using mixing enthalpy, binary phase diagrams with stable and meta-stable liquid miscibility gap, and the thermodynamic calculations. This graphical abstract shows the phase constitution and Solidification microstructure of the rapidly-solidified melt-spun ribbons in the TiZrHfAgV_0.2 HEA.

Preferential LDH-island coverage on IMPs by suppresses corrosion initiation by reducing the oxygen reduction reaction on IMPs.

Corrosion mechanism of aluminum 7075 alloy in aqueous medium with (a) sodium ions and magnesium ions, and (b) zinc ions at 25°C.

Optical microscopic images of as-received and electropolished aluminum specimens in a 0.2 M NaCl/PG solution at 303 K and U = 60 V for 2–30 min.

This shows sequential micrographs of microstructural damage and fractured inclusion behavior near the notch-tip in Mg alloy, with loading axis (horizontal). These graphs correspond to the loading points: (a) before the test and at (b) the Y, (c) P_max, (d) 0.8P_max, and (e) 0.4P_max points.

SEM micrographs of (a) un-peened TNTZ specimen and (b) to (e) TNTZ specimens with HAp layer after FPP for various treating times.

Above figures show relationship between microstructures and 3D complex impedance plots of Al-Si alloys additively manufactured by laser powder bed fusion. The annealed samples were used for the impedance measurements to investigate the effect of the microstructures on the corrosion behaviours.

The coating formed on Mg alloys by phosphating using cavitation bubbles showed a protective effect in the early stages when chlorides were attached.

Microstructure of the billet when the electromagnetic force was imposed during directional solidification for the Al-Si eutectic melts.

Microstructures of the (a) pure Ti, (b) Ti+0.11 mass% TiC, (c) Ti+0.33 mass% TiC, (d) Ti+0.56 mass% TiC, (d) Ti+0.67 mass% TiC and (d) Ti+ 1.11 mass% TiC samples. The degree of undercooling, ΔT, is also leveled in each figure.

Photographs of samples after direct APP treatment using pipe electrodes (a)-(c) and rod-shaped electrodes (d), (e).

The better static strength and impact behaviors of Al–10Si–0.4Mg/Ti–6Al–4V composite samples fabricated using an additive manufacturing process were shown in the experiments.

Process map for efficient deposition of the first layer.

ADC12 melted at 516–590 °C and had a latent heat capacity of 411.1 J g⁻¹. ADC12 had a heat storage density of approximately 1.84 GJ m⁻³ at ΔT = 300 °C.

A hybrid heat storage material combining Solar Salt and Al–Cu–Si MEPCM was developed, offering higher heat storage density and thermal conductivity than either material alone.

A latent heat thermal energy storage composite with an Al–Cu–Si alloy-based microencapsulated phase change material has been developed. This composite exhibits a high compressive strength of 32 MPa, even when the internal alloy is in a liquid state.